4.3-10 Connectors

4.3-10 Male Low PIM Push-On Connector Solder Attachment for 1/2" Superflex Cable

4.3-10 features

  • Can terminate to coax or terminal;
  • Can be male or female gender in standard polarity, with 50ohm impedance;
  • Body can be straight or right angle;
  • Mount Method can be bulkhead, 4 hole panel or mount-less;
  • Attachment methods include clamp/solder, crimp/solder, field replaceable or solder.
  • Brand:

    ROHO
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-17days

4.3-10 Male Low PIM Push-On Connector Solder Attachment for 1/2" Superflex Cable

 

The 4.3-10 connector offer the same, robust design as 7-16 connectors but are smaller and up to 40% lighter, allowing for much more dense, lighter weight applications. These designs are IP67 compliant when mated to protect against dust and water ingress for outdoor applications, and frequency max up to 6GHz; this 4.3-10 male connector has an interface type of 1/2" Superflex Cable and a 50ohm impedance, attachment method uses shield/contact solder/solder, its straight body is brass with nickel plating.

 

Specifications

ELECTRICAL DATA  
Impedance                                                                  50Ω
Frequency Range 6GHz
Dielectric withstanding voltage (at sea level) 4000 V rms,50Hz
Working voltage (at sea level) 2500 V rms,50Hz
Insulation resistance  100000 mΩ
Contact resistance Inner conductor: 0.4mΩ
Outer conductor: 1.5mΩ
RF leakage (at 1 GHz) 128dB
MECHANICAL DATA  
Coupling nut torque Recommended: 25Ncm--30Ncm / 221 in. lbs--260 in.lbs 
Proof torque: 35 Ncm / 310 in.lbs
Coupling nut retention force ≥1000N / 225.0 lbs
Contact captivation 200N / 45.0 lbs
Durability (matings) 500
ENVIRONMENTAL DATA  
Temperature range -65°C  to +165°C 
MATERIAL DATA  
Bodies Brass--ternary alloy plating 
Pin contacts Brass--Au/Ag plating
Socket contacts Phosphor bronze / Beryllium copper--Ag plated
Crimp ferrules Copper--ternary alloy plating 
Insulator PTFE
Gaskets Silicone rubber

 

Applications

  • Base Stations
  • Wireless Infrastructure
  • Small Cells
  • Distributed Antenna Systems (DAS)
  • Mobile Networks
  • MIMO Antennas

 

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